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RF and Microwave IC Design
Increasing levels of integration and increasing operating frequencies are the dominant trends in RF and microwave IC design. The mobile handset is now much more than just a means for making a phone call and the range of multimedia applications has been made possible, in part, by the increased levels of integration in the RF front-end. The increasing prevalence of Wi-Fi based WLANs has been facilitated by high levels of RF integration, as has the incorporation of Bluertooth wireless connectivity into numerous handheld consumer products.
Increased interest in higher operating frequencies is a result of emerging technologies and applications. Examples of emerging technologies include WiMAX and UWB. High frequency applications receiving increased attention include automotive radar, passive imaging and high data-rate wireless transceivers.
This move to increased use of higher operating frequencies has led in turn to process development, with SiGe, InGaP HBT, PHEMT and MHEMT processes all allowing high performance IC realisation at frequencies to mm-wave.
Attendance will provide delegates with the opportunity to learn new techniques and gain both a technical and commercial insight and the latest developments in this fast moving area.
The seminar will cover all aspects of RF and Microwave IC design including:
Highly integrated transceivers
PAs
Frequency sources
Low noise amplifiers and receivers
Phase and amplitude control components
Broadband passive devices
Frequency converters
UWB devices
ICs for RFID applications
mm-wave ICs
SoIC and SiP designs
MCMs
High frequency packaging
Innovations in RFOW test
EM modelling of ICs.
This seminar will provide a vital source of information to
IC designers
Layout engineers
RF and microwave engineers looking to broaden their knowledge
IC marketing engineers seeking to understand the latest developments
Academics and researcher in this field
More information can be found in http://www.theiet.org/events/event/7015170B-9F06-D264-769DDE6DBCCB0E67&i=1
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