Ansoft Application Workshop
11 Dec 2007
Location: Munich, Germany
Ansoft's 'First-pass System Success' application workshops will provide a forum for leading technology companies and Ansoft's technical staff to collaborate and discuss the latest simulation techniques and design methodologies to help engineers achieve first-pass system success when designing high performance electronic systems. Topics include: - IC design and verification - Signal- and power-integrity simulation - RF, microwave and antenna design - Advanced packaging and PCB design - Electromechanical and power systems design - Medical electronics - EMI/EMC
Suggested Topics for Presentations*
- Next-generation antenna design
- Incorporating passive components into high-frequency, analog IC, and RFIC designs
- Optimization and synthesis of high-performance microwave components
- RCS and related aerospace applications
- Automotive RF applications, including RKE, Bluetooth®, SDARS, GPS, and EMI/EMC
- IC/package/PCB co-design
- Advanced packaging: SIP, POP, and stacked packages
- Power integrity to support mixed-signal IC design
- RFID design
- Multi-gigabit-speed serial design: PCI Express Gen 2, HyperTransport 3, TMDS
- Utilizing compute farms to significantly reduce simulation time Power electronics and drives
- Hybrid technology and automotive systems design
- VHDL-AMS (IEEE standard 1076.1)
- Electromechanical components
· Industrial automation
For further information visit: http://www.ansoft.com/firstpass/papers.cfm
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